Premium Platforms
Platform bring-up, BSP integration, vendor components and production hardware/software integrations for top-tier platforms such as Qualcomm, Rockchip, NXP.
We build embedded software end to end — from silicon bring-up to shipped applications. We work with the most popular platforms for industrial, medical, defense, and consumer applications: Qualcomm, Rockchip, TI, NXP and more. Our expertise covers the entire embedded stack. Hardware design, drivers, AOSP, Yocto, Qt applications and more. Our team specializes in bringing all layers together to deliver complete, production-ready solutions.
One team, the full stack — board bring-up, drivers, and the application layer on top.
Platform bring-up, BSP integration, vendor components and production hardware/software integrations for top-tier platforms such as Qualcomm, Rockchip, NXP.
Kernel integration, HALs, system services, optimized UI, security and platform-level debugging.
Device drivers, recipes, custom layers and efficient and secure distributions for your embedded device.
A sample of what we've shipped.
End-to-end AOSP and BSP development for a production device integrating multiple sensors, from bring-up to shipped firmware.
ISP and camera pipeline tuning for automotive imaging applications, meeting the image quality and reliability requirements of the automotive domain.
Real-time software development for medical devices, where timing guarantees and reliability are core requirements.
Design and implementation of over-the-air update infrastructure for an AOSP-based medical device.
Native driver and pipeline support for non-standard camera sensors, integrating them into the platform's camera stack.
A small, focused team that talks directly to your engineers and slots into your existing process — no unnecessary layers, no overhead.
Specialist engineering capacity, applied where it's needed.
Tell us what you are building and where you need support.
hello@dc3ll.com →